| EP7309-CB-C | High-performance, low-power system on chip enchanced digital audio interface in 208-pin PBGA package. Operational temperature range from 0°C to 70°C. | Datasheet*) |
| EP7309-CR-C | High-performance, low-power system on chip enchanced digital audio interface in 208-pin PBGA package. Operational temperature range from 0°C to 70°C. | Datasheet*) |
| EP7309-CV-C | High-performance, low-power system on chip enchanced digital audio interface in 208-pin PQFP package. Operational temperature range from 0°C to 70°C. | Datasheet*) |
| EP7309-EB-C | High-performance, low-power system on chip enchanced digital audio interface in 208-pin PBGA package. Operational temperature range from 0°C to 70°C. | Datasheet*) |
| EP7309-ER-C | High-performance, low-power system on chip enchanced digital audio interface in 208-pin PBGA package. Operational temperature range from 0°C to 70°C. | Datasheet*) |
| EP7309-EV-C | High-performance, low-power system on chip enchanced digital audio interface in 208-pin PQFP package. Operational temperature range from 0°C to 70°C. | Datasheet*) |
| EP7309-IB-C | High-performance, low-power system on chip enchanced digital audio interface in 208-pin PBGA package. Operational temperature range from 0°C to 70°C. | Datasheet*) |
| EP7309-IR-C | High-performance, low-power system on chip enchanced digital audio interface in 208-pin PBGA package. Operational temperature range from 0°C to 70°C. | Datasheet*) |
| EP7309-IV-C | High-performance, low-power system on chip enchanced digital audio interface in 208-pin PQFP package. Operational temperature range from 0°C to 70°C. | Datasheet*) |
| EP7309 | HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE | Datasheet*) |
